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Tel: 886-09-20375081
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Laser direct writing system
Model: HT-LDW
Category: Automatic/Industrial Machines & Equipments / Automated Machinery & Equipments / Laser Cutting & Engraving Machines
Characteristics
[Characteristics]：
1. By using patent construction,it has good 2D dynamic precision motion.
2. Integration of different wavelengths with laser beam shaping,the isolatin paths get the width of 30μm(or 10μm/40μm…)on the surface circuit with less damage for base material.
3. The multi-objectives optimalization to control the scribing depth、heat effect zone、and related quality insurance.
[Advantages]：
1. High yield process.
2. Less particles pollution.
3. Direct writing curve path with similar linewidth and quality
4. Intelligent vision with CAM for CAD compensation
5. Optimization technology for quality control
[Application]：
1. LCD short rings cutting processing
2. Solar cell thin film direct writing isolation
3. Direct writing Mo-Al-Mo circuits on sensor glass of touch panel
4. Direct writing Ag paste on sensor film of touch panel
5. Direct patterning ITO(nano wires/TCO…)on sensor film/glass
6. LED wafer cutting process
7. Semi-wafer marking
Specifications
[Main Specification]：
1. Laser source：ns/ps/fs 1064/532/355/266nm
2. Loading table：standard 500mmx500mm ceramic(high flatness)
3. Vision positioning：2D CAD/CAM HMI(option :3D CAD/CAM)
4. Optic module：collimating、beam shaping with focusng lens for applications
5. Motion：XY highflatness(<+/-10um) linear motors(resolution<+/-5um)
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