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• Intel® Core™ i7 Processor-Based Fanless Embedded Computer MXC-6000

 

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Intel® Core™ i7 Processor-Based Fanless Embedded Computer MXC-6000

Model: Matrix MXC-6000

Category: Automatic/Industrial Machines & Equipments / Automated Machinery & Equipments / Automatic Control Systems

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Characteristics

The Matrix MXC-6000 series of powerful fanless, expandable embedded computers feature the new Intel® Core i7 2.0 GHz processor for maximized computing. The MXC-6000 inherits its exceptional fanless and cable-free design from ADLINK's existing Matrix C series.

The MXC-6000 series' Intel® Core i7 2.0 GHz processor and Intel® QM57 chipset deliver a level of performance ideal for image and vision measurement and automation applications. PCI and PCIe slots allow integration of off-the-shelf PCI/PCIe cards for development of configurable application platforms. 16 built-in isolated DIO channels enable standardized industrial control. A DVI-I connector output on the front panel allows direct connection to a LCD panel, and one eSATA port supports storage expansion or hot-swapping SATA drives.

Leveraging a reliable fanless and durable cable-free design, the MXC-6000 series exhibits excellent dependability in harsh environments, where severe temperature variation and vibration may exist. The MXC-6000 series provides an optional hot-pluggable fan module to dissipate heat generated within the system when high power consumption PCI/PCIe cards are installed. This inventive mechanical design retains a cable-free structure which dramatically improves thermal stability when PCI/PCIe cards are installed.

The MXC-6000 also provides an USB 2.0 port internally located on a riser card, enabling heightened reliability for secure applications, with license keys or password encryption on an internal USB dongle dramatically improve system security.

Combining a reliable design with more computing power and innovative features, the Matrix MXC-6000 series is the optimal choice on which to base any rugged application system.

*Extending the operating temperature to -10¢Xc to 60¢Xc is optional and requires use of an industrial solid-state drive storage device. Heat dissipation from inserted PCI/PCIe cards may affect thermal performance.

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