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• 3D MicroMac TLS-DicingTM System for Separation of SiC Wafers

 

3D MicroMac TLS-DicingTM System for Separation of SiC Wafers

 

Model: microDICETM

Category: Automatic/Industrial Machines & Equipments / Automated Machinery & Equipments / Laser Cutting & Engraving Machines

 

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Characteristics

 

3D-Micromac‘s high-performance microDICETM laser dicing system separates wafers into dies using TLS-DicingTMtechnology (Thermal-Laser-Separation).
microDICETM significantly reduces the dicing cost per wafer.
Cleaving with microDICETM provides outstanding edge quality while increasing the yield and the throughput, especially for SiC.

microDICETM offers:
• Significant higher throughput due to dicing speed up to 300 mm/s
• Minimal cost of ownership
• More dies per wafer by reduced street width

‚The microDICETM standard system configuration consists of:
‚. Cleaving function
‚. Soft scribe function
‚. Micro stretching function

Available options:
‚. Automated wafer handling
‚. Second unit for scribing
‚. SECS/GEM interface
‚. Filter fan unit
‚. Drying unit

 

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