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Contact Information
No.37, Guangyu Rd., Sanmin Dist., Kaohsiung City 807, Taiwan
Tel: 886-7-3869247
Fax: 886-7-3864721
Wafer laser marking machine
Model: YSLS-75
Category: Automatic/Industrial Machines & Equipments / Automated Machinery & Equipments / Laser Cutting & Engraving Machines
Characteristics
3-inch sapphire wafers using laser / laser, high-precision high-speed wafer thin to draw deep marks in order to lower the chip wafer cutting machine cutting.
Equipment: marble platform + linear motor + DD motor + high-resolution optical scale, analytical precision of 0.0001mm. + High-resolution camera and lens + laser machine Italy
Software: YSPOWER laser machine software, automated identification of the position and motion platform, high-precision. Easy to operate intelligent software
Specifications
3-inch sapphire wafers using laser / laser, high-precision high-speed wafer thin to draw deep marks in order to lower the chip wafer cutting machine cutting.
Equipment: marble platform + linear motor + DD motor + high-resolution optical scale, analytical precision of 0.0001mm. + High-resolution camera and lens + laser machine Italy
Software: YSPOWER laser machine software, automated identification of the position and motion platform, high-precision. Easy to operate intelligent software
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