Our Products
- Surface Finishing Equipment (5)
- Inspecting/Measuring Instrument and Parts (2)
- Diamond, CBN Tools and Cutters (1)
- Automated Equipment for Transformers and Rectifiers (1)
- Others (1)
Contact Information
59 Alley 21 Lane 279, Chung Cheng Road, Yung Kang City, Tainan, TAIWAN
Tel: 886-6-2323927
Fax: 886-6-2013306
Atmospheric Pressure Plasma
Model: SAP003
Category: Automatic/Industrial Machines & Equipments / Industrial Machines / Surface Finishing Equipment
Characteristics
Production Description
Creating Nano SAP003 Atmospheric Pressure Plasma (AP Plasma) was designed by professional engineers in an eco-friendly environment to completely remove any kind of organic pollutants. SAP003 AP plasma treatment system’s unique design features and certified R&D patterns will tremendously increase surface bonding under normal operating conditions to produce ecofriendly products without compromising the reusability of materials. Our mission and value proposition is to create an error-free production environment to increase the overall benefits & profits of our clients.
Unique Functionalities
SAP003 Atmospheric Plasma Jet effectively enhances the stability and smoothness of the surface cleaning; stabilizes the plasma flow and is arc free; has a higher degree of surface modifications; improves the life time of electrodes; improves the quality of the components package; improves the reliability of printability; has quick Interaction of adhesion and mount ability; is designed to operate and adjust the speed of the process; controls the flow of gas & target distance at any period of the process; Organic Materials include: Glass, Plastic, Metallic, Ceramics, Rubber etc.
Product Features
Compact size and easy to install
Start / Stop at any time
Safe operation and maintenance
Highly efficient speed
Improved throughput of cleaning process
Designed to support both in-line and off-line operations
Cutting edge nozzle technology to support a range from 3~30mm
Multiple design patterns are available
Zero degrees of contamination & arc formation
Designed to operate without a vacuum chamber
Generation of Process gases: N2, Air (CDA), Oxygen
Industry Applications
Supports all kind of Industrial surface modification and activation process
Supports and improves various surface cleaning methods before process
STN-LCD, TFT-LCD, OLED, PDP and OLB process of COG ITO electrode surface clean before process
COF (ILB) and COB electrode surface cleaning process
LCD or OLED glass cleaning process
IC Packaging (Flip Chip, CSP, BGA, TCP, or Lead Frame, etc.) and LED package for surface cleaning and modification
PCB surface cleaning, activation, modification
Support Desmear process methods
Wafer surface cleaning, coater cleaning & etching process
Supports various Industrial electronic components surface cleaning, activation & modification
Improved printability, adhesive surface roughening & cleaning before process
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